| Source: Facts & Factors
Pune, INDIA
Miami, FL, Aug. 19, 2022 (GLOBE NEWSWIRE) — Facts and Factors has published a new research report titled “System in Package (SiP) Technology Market Size, Share, Growth Analysis Report By Packaging Technology (2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging), By Packaging Method (Wire Bond and Flip Chip), By End-User (Consumer Electronics, Automotive, Telecommunication, Industrial Systems, Aerospace and Defense, and Others), and By Region – Global and Regional Industry Insights, Overview, Comprehensive Analysis, Trends, Statistical Research, Market Intelligence, Historical Data and Forecast 2022 – 2028” in its research database.
“According to the latest research study, the demand of global System in Package (SiP) Technology Market size & share was valued at approximately USD 14,952.5 million in 2021. The market is expected to grow above a CAGR of 9.5% and is anticipated to reach over USD 25,774.9 million by 2028.”
The report analyses the System in Package (SiP) Technology market’s drivers and restraints, as well as the impact they have on-demand throughout the projection period. In addition, the report examines global opportunities in the global System in Package (SiP) Technology market.
What is System in Package (SiP) Technology? How big is the System in Package (SiP) Technology Industry?
A system in package (SiP) is a single module made up of several integrated circuits that carry out all of the tasks associated with an electronic system. SiPs often combine all external passive components onto a single tiny chip, which reduces the cost of designing and building a printed circuit board (PCB). The SiP is less corrosive, smaller, more cost-effective, and can function in demanding system conditions. It is widely utilized in many sectors, including telecommunications, automotive, and consumer electronics.
An illustration of a SiP could have many chips, such as a specialized CPU, DRAM, and flash memory, together with passive parts, such as capacitors and resistors, installed on the same substrate. This means that a multi-chip package may be used to build a fully functioning unit that only requires a small number of additional components. This lessens the complexity of the printed circuit board and the overall design, which is especially useful in contexts with limited space, such as MP3 players and mobile phones.
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Key Insights from Primary Research
Competitive Players
The report contains qualitative and quantitative research on the global System in Package (SiP) Technology Market, as well as detailed insights and development strategies employed by the leading competitors. The report also provides an in-depth analysis of the market’s main competitors, as well as information on their competitiveness. The research also identifies and analyses important business strategies used by these main market players, such as mergers and acquisitions (M&A), affiliations, collaborations, and contracts. The study examines, among other things, each company’s global presence, competitors, service offers, and standards.
Some of the main players in the global System in Package (SiP) Technology market include;
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Market Growth Drivers
Several factors, including the introduction of 5G network-connected devices, the high demand for small electronics devices with internet connectivity, and the increase in Internet of Things (IoT) devices, are predicted to propel the growth of the global system in package (SiP) technology industry. In addition, the industry is developing as smartphones, and smart wearables are more adopted. Higher levels of integration, however, cause thermal problems, which are a significant commercial limitation. On the other hand, strong demand from Asia-Pacific is anticipated to drive market expansion throughout the projection period.
System in Package (SiP) Technology Market: COVID-19 Impact Analysis
The COVID-19 pandemic crisis, which originated in China and expanded over the world, hampered the growth of nearly every country’s semiconductor industry and economy. The manufacturing sector has suffered greatly as a result of the facilities remaining shuttered for a while. Electronics, vehicles, and other industrial goods are among the products seeing a decline in sales. Businesses, public areas, schools, and other venues remained closed due to the customer’s absence.
Because no mass production of these items occurred during the lockout, demand for electronics components has declined overall from businesses and consumers, and the microelectronics revenue model has suffered. Following the shutdown, the semiconductor industry started to regain market share as production facilities started up again while taking pains to avoid alienating the general public. The demand for small form factor electronics devices, particularly smartphones and health monitoring, has increased, which has sped up industry growth.
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System in Package (SiP) Technology Market: Segmentation Analysis
The global system in the package sip technology market is segregated based on packaging technology, packaging method, end-users, and regions. Based on packaging technology, the market is divided into 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. According to packaging technology, the 2.5D IC packaging category led the market in 2021. Based on the packaging method, the market is divided into wire bonds and flip chips. According to the packaging method, the wire bonds segment led the market in 2021.
Based on end-users, the market is divided into consumer electronics, automotive, telecommunications, industrial systems, aerospace and defense, and others. The automobile segment led the market in 2021, according to end users.
Regional Dominance:
The global system in the package sip technology market is divided into geographic regions: North America, Latin America, Europe, Asia Pacific, Middle East, and Africa. In terms of market share and revenue, Asia-Pacific now rules the package (SIP) market system and will maintain this dominance during the projection period. This is a result of the expanding consumer electronics industry’s use of technology and the increasing number of businesses operating in this area.
The market in the region is further boosted by the presence of various electronic packaging companies that provide electronic packaging technology and materials, such as Samsung Electronics Corporation Ltd and Taiwan Semiconductor Manufacturing Co. Ltd. Additionally, the region’s expanding population and increasing disposable income are two significant factors boosting consumer electronics demand, which is fueling the region’s electronic packaging industry even more quickly.
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The global System in Package (SiP) Technology market is segmented as follows:
By Packaging Technology
By Packaging Method
By End User
By Region
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